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  • ATS-14F-01-C3-R0

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    The **ATS-14F-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 40mm x 40mm | | **Height** | 10mm (Low Profile) | | **Thermal Resistance** | 22.05°C/W (Unducted Flow @ 100 LFM) | | **Regulatory** | RoHS Compliant | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical **pushPIN™** system. This provides: * **Constant Pressure:** Ensures optimal interface contact between the component and the heat sink. * **Reliability:** Resistant to vibration and shock, making it suitable for industrial or automotive electronics. * **Ease of Rework:** Can be removed and reinstalled without damaging the PCB or leaving residue. ### B. Thermal Performance The "C3" in the part number indicates a specific thermal interface material or performance tier. This heat sink uses a **straight fin design**, which is optimized for **forced air cooling** (fans). The low profile (10mm) makes it ideal for dense server racks or thin electronic enclosures. ### C. Material and Coating * **Aluminum 6063:** Provides high thermal conductivity while remaining lightweight. * **Blue Anodized Finish:** The anodization layer provides corrosion resistance and slightly improves radiative heat transfer. It also acts as an electrical insulator on the surface of the aluminum. --- ## 3. Physical Layout The dimensions are standardized for square electronic packages: ```text 40.00 mm _________________ | | | [FINS] | 40.00 mm | | |_________________| [10.00 mm Height] ``` --- ## 4. Typical Applications This component is commonly found in: * **Networking Hardware:** Routers, switches, and modems. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators and MOSFETs.
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance for this part?
    • ⤷ How does the pushPIN™ attachment affect the PCB layout requirements?
    • ⤷ Can this heat sink be used with a custom thermal pad or grease?