ATS-14F-01-C3-R0
AI

The **ATS-14F-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure.
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## 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions** | 40mm x 40mm |
| **Height** | 10mm (Low Profile) |
| **Thermal Resistance** | 22.05°C/W (Unducted Flow @ 100 LFM) |
| **Regulatory** | RoHS Compliant |
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## 2. Key Electronic Features
### A. pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this model uses a mechanical **pushPIN™** system. This provides:
* **Constant Pressure:** Ensures optimal interface contact between the component and the heat sink.
* **Reliability:** Resistant to vibration and shock, making it suitable for industrial or automotive electronics.
* **Ease of Rework:** Can be removed and reinstalled without damaging the PCB or leaving residue.
### B. Thermal Performance
The "C3" in the part number indicates a specific thermal interface material or performance tier. This heat sink uses a **straight fin design**, which is optimized for **forced air cooling** (fans). The low profile (10mm) makes it ideal for dense server racks or thin electronic enclosures.
### C. Material and Coating
* **Aluminum 6063:** Provides high thermal conductivity while remaining lightweight.
* **Blue Anodized Finish:** The anodization layer provides corrosion resistance and slightly improves radiative heat transfer. It also acts as an electrical insulator on the surface of the aluminum.
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## 3. Physical Layout
The dimensions are standardized for square electronic packages:
```text
40.00 mm
_________________
| |
| [FINS] | 40.00 mm
| |
|_________________|
[10.00 mm Height]
```
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## 4. Typical Applications
This component is commonly found in:
* **Networking Hardware:** Routers, switches, and modems.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling voltage regulators and MOSFETs.
- ⤷
What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ How does the pushPIN™ attachment affect the PCB layout requirements?
- ⤷ Can this heat sink be used with a custom thermal pad or grease?