The **ATS-14F-05-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 8.72°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Pattern** | Straight Fin | --- ## Key Components & Features ### 1. The Heat Sink Body The main body is made of **aluminum**, which provides a balance between high thermal conductivity and low weight. The **Blue Anodized** finish is not just for aesthetics; it provides a layer of protection against corrosion and slightly increases surface emissivity for better radiation cooling. ### 2. Attachment System (Push-Pin) This specific model uses a **brass push-pin** mechanism. * **Ease of Install:** It allows for quick mounting to the Printed Circuit Board (PCB) without complex tools. * **Compression Spring:** It includes a high-performance compression spring to ensure even pressure across the component, maximizing thermal contact. ### 3. Thermal Interface Material (TIM) The "R0" at the end of the part number usually signifies that the product comes with a pre-applied thermal interface material. In this series, it is typically **T766**, a high-performance phase-change material that fills microscopic air gaps between the heat sink and the chip. ### 4. Fin Design The **Straight Fin** design is optimized for environments where there is a clear, directional airflow (forced convection). The 25mm height allows for a significant surface area for heat dissipation. --- ## Performance Metrics (Thermal Resistance) Thermal resistance indicates how effectively the part moves heat away from the component. Lower values are better. * **Unducted Flow (200 LFM):** 8.72 °C/W * **Unducted Flow (400 LFM):** 3.36 °C/W * **Ducted Flow (200 LFM):** 2.35 °C/W --- ## Applications * **Networking Gear:** Switches and routers. * **Industrial PCs:** Compact systems requiring passive or assisted cooling. * **Power Supplies:** Cooling MOSFETs or voltage regulators.