The **ATS-14F-100-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is part of the "pushPIN™" series, designed for cooling electronic integrated circuits (ICs) like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Type** | Straight Fin | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.84°C/W (at 100 LFM) | --- ### 2. Physical Dimensions Precision is critical for PCB layout and clearance. * **Width/Length:** 45mm x 45mm * **Height:** 25mm (Distance from the base to the top of the fins) * **Pitch:** 1.27mm (Standard for the push-pin spacing) --- ### 3. Key Electronic Components & Features #### A. The Heat Sink Body The body is made of **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The "Straight Fin" design allows for efficient airflow in a single direction, typically paired with a system chassis fan. #### B. The pushPIN™ Attachment Unlike adhesive tapes or clips, this part uses a spring-loaded push-pin mechanism. This provides: * **Constant Pressure:** Ensures a consistent interface between the heat sink and the electronic component. * **Mechanical Stability:** Protects the component from vibration and shock. * **Ease of Maintenance:** Can be removed and re-installed without damaging the PCB. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the part comes pre-applied with a high-performance **Thermal Interface Material**. This fills the microscopic air gaps between the chip and the aluminum base, significantly lowering thermal resistance. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **14F** | Specific series/mechanical footprint | | **100** | Fin Pitch/Designation | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Packaging or Thermal Pad variant | --- ### 5. Application Use Cases * **Computing:** Cooling chipsets on motherboards or networking switches. * **Industrial:** Managing heat in motor controllers or power supplies. * **Embedded Systems:** Protecting SoCs (System on Chips) in fan-less or forced-air enclosures.