The **ATS-14F-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 30mm | | **Fin Style** | Straight Fin (provides vertical airflow channels) | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Thermal Resistance** | 6.77°C/W (at 100 LFM) to 1.17°C/W (at 700 LFM) | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Detailed Component Breakdown #### A. Thermal Performance The heat sink is designed to dissipate heat from a component into the surrounding air. The performance varies based on airflow (Linear Feet per Minute - LFM): * **Low Airflow (100 LFM):** 6.77 °C/W * **High Airflow (700 LFM):** 1.17 °C/W * **Efficiency:** The "Straight Fin" design is optimized for environments where there is a clear, directional path for air to flow through the fins. #### B. The pushPIN™ Mounting System The suffix `-R0` indicates the mounting style. This system uses: 1. **Plastic Push Pins:** These snap into pre-drilled holes on the PCB. 2. **Compression Springs:** These ensure constant, even pressure between the heat sink and the electronic chip, which is critical for maximizing heat transfer. #### C. Thermal Interface Material (TIM) This part comes with **T766** pre-applied to the base. * **Purpose:** It fills microscopic air gaps between the chip surface and the heat sink base. * **Benefit:** Being "C3" grade, it offers high thermal conductivity, reducing the "bottleneck" effect at the point of contact. --- ### 3. Part Number Decoder Understanding the manufacturer's logic helps in identifying its specific features: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **14:** Series Number * **F:** Fin Attachment (F = Push Pin) * **101:** Specific Dimension/Geometry code * **C3:** Thermal Interface Material type (High performance) * **R0:** Revision/Packaging code --- ### 4. Application Examples This specific heat sink is commonly used in: * **Telecommunications:** Cooling networking switches and routers. * **Industrial PCs:** Maintaining stability in high-temperature environments. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.