The **ATS-14F-102-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the Advanced Thermal Solutions (ATS) "pushPIN™" series. --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions** | 45mm x 45mm | | **Height (Fin Height)** | 33mm | | **Thermal Resistance (Airflow)** | 1.04 °C/W @ 200 LFM | | **Fin Style** | Straight Fin | --- ### 2. Key Components & Features #### A. The Heat Sink Body * **Material:** Constructed from high-quality aluminum for optimal thermal conductivity. * **Fin Design:** It features a "straight-fin" pattern. This is ideal for systems with consistent, unidirectional airflow, as it provides low pressure drop while maximizing surface area. * **Coating:** The "C2" in the part number indicates a **Blue Anodized** finish, which protects the aluminum from corrosion and slightly improves radiant heat transfer. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or complicated screws, this part uses a spring-loaded push-pin mechanism: * **Compression Springs:** These provide a precise "Force on Heat Sink" to ensure the thermal interface material (TIM) is compressed evenly against the chip. * **Installation:** It requires pre-drilled holes in the PCB. The pins snap through the holes, securing the sink firmly. #### C. Thermal Interface Material (TIM) * The part usually comes with a pre-applied **Phase Change Material** or high-performance thermal pad on the base to ensure a low-resistance path between the electronic component (CPU/GPU/FPGA) and the heat sink. --- ### 3. Application Use Cases This specific heat sink is typically used for: 1. **High-Power Semiconductors:** Cooling FPGAs, ASICs, or processors in networking gear. 2. **Industrial Controls:** Managing heat in power supplies or motor controllers. 3. **Telecommunications:** Cooling components in base stations or high-speed routers where vertical space (33mm height) allows for large fin surface area. --- ### 4. Part Number Breakdown ```text ATS - 14 - F - 102 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Finish (Blue Anodized) | | | +------------- Part Customization Code (Thermal performance) | | +------------------ Fin Style (F = Fine/Straight) | +----------------------- Push-pin series / size +---------------------------- Advanced Thermal Solutions ```