The **ATS-14F-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table details the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 18.78°C/W (Unducted Flow @ 100 LFM) | | **Finish** | Blue Anodized | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical **pushPIN™** system. - **Components:** It consists of a plastic pin and a compression spring. - **Benefit:** It provides a precise, consistent pressure (preload) against the heat source, ensuring optimal thermal contact and preventing the heat sink from shifting due to vibration. #### B. Straight Fin Design The "Straight Fin" geometry is optimized for **forced-air cooling** (fan-driven airflow). The gaps between the fins allow air to pass through with low resistance, carrying heat away from the aluminum base. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change material or high-conductivity grease that fills microscopic air gaps between the chip and the heat sink, significantly lowering thermal impedance. --- ### 3. Nomenclature Breakdown The part number follows a specific logic: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **14F** | Series/Version | | **11** | Specific Dimension Profile | | **C2** | Thermal Performance/Material Grade | | **R0** | RoHS Compliant / Revision Code | --- ### 4. Applications This part is typically found in: * **Telecommunications:** Networking switches and routers. * **Industrial PC:** Cooling small form-factor processors. * **Power Supplies:** Heat dissipation for MOSFETs or Voltage Regulators.