## Technical Analysis: ATS-14F-115-C2-R0 The **ATS-14F-115-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, engineered for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 5.33 °C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring no interference with surrounding motherboard components: * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 20.00 mm (Fin height) * **Pitch (Hole Pattern):** 45.00 mm (diagonal/square layout) --- ### 3. Component Breakdown #### A. The Heat Sink Body The unit uses a **cross-cut fin design**. This allows for "multi-directional" airflow, meaning it can dissipate heat effectively even if the air is not blowing directly parallel to the fins. The aluminum is finished with a **Blue Anodize**, which provides corrosion resistance and improves thermal emissivity. #### B. The pushPIN™ Mechanism Instead of messy adhesives or difficult screws, this part uses a brass push-pin with a stainless steel spring. * **Benefits:** Provides consistent pressure (clamping force) across the chip surface to ensure optimal heat transfer. * **Installation:** Requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * This is a high-performance thermal pad/grease that fills microscopic air gaps between the chip and the heat sink. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | 700 LFM | | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 5.33 | 2.58 | 1.80 | 1.45 | --- ### 5. Application Use Cases 1. **Networking Hardware:** Switches and routers where airflow may be turbulent. 2. **Embedded Systems:** Industrial PCs requiring secure, vibration-resistant mounting. 3. **Power Supplies:** Cooling MOSFETs or power regulators.