The part number **ATS-14F-12-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed specifically for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the mechanical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 12.70mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | ~4.41°C/W (at 200 LFM) | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the configuration: * **ATS**: The manufacturer (Advanced Thermal Solutions). * **14F**: Denotes the specific fin pattern and series type. * **12**: Represents the height of the heat sink (12.7mm). * **C2**: Indicates the thermal performance and material grade (Blue Anodized Finish). * **R0**: Refers to the revision and packaging status (RoHS compliant). --- ### 3. Key Electronic Functions While the heat sink itself is passive (no electricity flows through it), it is critical for the survival of active electronic parts: 1. **Thermal Dissipation**: It increases the surface area of a semiconductor package, allowing heat to transfer more efficiently from the silicon die to the surrounding air. 2. **Phase Change Material (T766)**: The "C2" variant usually comes with a pre-applied thermal pad. This material melts at operating temperatures to fill microscopic air gaps between the chip and the metal, reducing thermal impedance. 3. **Mechanical Attachment (pushPIN™)**: Unlike adhesive tapes, the pushPIN system provides consistent pressure. This ensures the thermal interface remains effective even under vibration or mechanical shock. --- ### 4. Comparison with Standard Heat Sinks | Feature | ATS-14F-12-C2-R0 | Standard Extruded Heat Sink | | :--- | :--- | :--- | | **Fin Design** | Tapered / High-Aspect Ratio | Straight Fins | | **Airflow Efficiency** | Optimized for low pressure drop | High resistance to airflow | | **Mounting** | Precise mechanical pins | Adhesive tape or clips | ---