The **ATS-14F-121-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and physical characteristics. ### 1. General Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Series** | pushPIN™ | | **Base Part Number** | ATS-121 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | --- ### 2. Physical Dimensions This heat sink is designed for specific square-pattern PCB layouts. * **Size (L x W):** 45mm x 45mm * **Height:** 10mm (Low Profile) * **Pitch (Fin Spacing):** Fine Pitch * **Pin Spacing:** 38mm x 38mm (The distance between the mounting holes on the PCB). --- ### 3. Thermal Performance Thermal resistance determines how effectively the part moves heat away from the component. This varies based on the airflow (Velocity). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 9.48 | | **300 (1.5 m/s)** | 4.47 | | **500 (2.5 m/s)** | 3.35 | | **700 (3.5 m/s)** | 2.81 | --- ### 4. Key Components and Design Features 1. **Fin Design:** It uses a **Cross-Cut** fin pattern. This allows for multi-directional airflow, making it versatile for systems where the air might not be blowing in a single straight line. 2. **Attachment (pushPIN™):** It utilizes a spring-loaded push-pin mechanism. This ensures constant pressure (clamping force) on the high-heat component, improving thermal transfer. 3. **Thermal Interface Material (TIM):** The "R0" designation typically indicates that the unit comes with a pre-applied **T766** phase-change material or similar high-performance thermal pad on the base. 4. **Material Construction:** Made from extruded aluminum (6063), which provides a balance between lightweight design and high thermal conductivity. --- ### 5. Common Applications * **BGA Cooling:** Ideal for Ball Grid Array processors or FPGAs. * **Telecommunications:** Used in routers and switches where space is limited but heat density is high. * **Power Supplies:** Cooling MOSFETs or power regulators.