The **ATS-14F-128-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or power modules. ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Plastic/Brass Pins) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height** | 25.00 mm | | **Fin Type** | Flat Fin (Straight) | | **Thermal Resistance** | ~2.90°C/W (at 100 LFM) | --- ### 2. Core Components and Materials #### A. The Heat Sink Body The body is made of **Aluminum 6063**, which is the industry standard for thermal conductivity and weight efficiency. The "C2" designation in the part number indicates a **Blue Anodized finish**, which increases surface emissivity and provides corrosion resistance. #### B. PushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical mounting system: * **Compression Springs:** Provide precise pressure (load) on the component to ensure maximum thermal contact. * **Plastic/Brass Pins:** Inserted into pre-drilled holes on the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number indicates that the unit comes with **pre-applied Thermal Interface Material**. This is usually a high-performance phase-change material or thermal grease that fills microscopic air gaps between the heat sink and the chip. --- ### 3. Thermal Performance Profile Heat sinks are evaluated by their thermal resistance ($R_{th}$) measured in degrees Celsius per Watt (°C/W). Lower values indicate better cooling performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.91 | | 300 (1.5 m/s) | 1.44 | | 500 (2.5 m/s) | 1.13 | --- ### 4. Typical Applications * **Telecommunications:** Cooling of high-speed networking switches and routers. * **Computing:** Secondary cooling for chipsets or power delivery components on motherboards. * **Industrial Power:** Managing heat for motor controllers or power supplies.