The **ATS-14F-13-C2-R0** is a specific electronic component belonging to the thermal management category. It is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "maxiFLOW" series. --- ## 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-14F-13-C2-R0 | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 13.70°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm | | **Flammability Rating** | UL 94V-0 | --- ## 2. Component Design & Features This part is designed for high-density electronic cooling where airflow is constrained. ### A. maxiFLOW™ Fin Design The "maxiFLOW" geometry features a tapered fin structure. This design increases the surface area for heat dissipation while reducing the pressure drop across the heat sink. This makes it highly efficient in forced-convection environments (systems with fans). ### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the **pushPIN™** system provides: * **Constant Pressure:** Ensures a firm interface between the heat sink and the component (like a CPU or FPGA). * **Easy Installation:** Features a flexible spring mechanism that clicks into pre-drilled holes on the PCB. * **Reliability:** Better shock and vibration resistance compared to thermal tape. ### C. Material and Coating * **Aluminum:** Chosen for its lightweight properties and high thermal conductivity. * **Blue Anodization:** Not just for aesthetics; the anodized layer provides corrosion resistance and slightly improves thermal emissivity. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **14** | Series/Product Family (maxiFLOW) | | **F** | Fine Pitch (Fin density) | | **13** | Specific model size/height variant | | **C2** | Thermal Interface Material (TIM) included (typically T766) | | **R0** | RoHS Compliant / Revision code | --- ## 4. Typical Applications This heat sink is commonly found in: * **Telecommunications:** Cooling high-speed chips in routers and switches. * **Data Centers:** Cooling processors on server blades. * **Embedded Systems:** Industrial PCs where vertical space (15mm height) is limited.