The **ATS-14F-133-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 70mm x 70mm x 10mm | | **Thermal Resistance** | 2.10°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Component Features ### A. pushPIN™ Attachment System The "R0" suffix often refers to the specific attachment kit. The **pushPIN™** system ensures a secure, high-pressure connection to the PCB. - **Springs:** Provides a consistent "Force on Chip" to ensure maximum heat transfer. - **Hardware:** Usually includes brass or plastic pins that lock into pre-drilled holes in the motherboard/PCB. ### B. Material and Finish - **Aluminum (AL6063):** Chosen for its excellent balance of thermal conductivity and weight. - **Blue Anodized Coating:** Provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a phase-change or high-performance thermal grease that fills microscopic air gaps between the component surface and the heat sink base to lower thermal impedance. --- ## 3. Thermal Performance Profile Thermal resistance determines how effectively the heat sink removes heat. Effectiveness scales with airflow (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM (Unducted)** | 4.11 | | **200 LFM (Unducted)** | 2.10 | | **400 LFM (Unducted)** | 1.30 | | **600 LFM (Unducted)** | 1.02 | --- ## 4. Application Use Cases This specific model is a **low-profile** heat sink (only 10mm tall), making it ideal for: 1. **1U Servers:** Where vertical clearance is extremely limited. 2. **Embedded Systems:** Industrial PCs where space is tight. 3. **Networking Equipment:** High-speed routers or switches that require passive cooling supplemented by chassis fans.