ATS-14F-14-C2-R0
AI

The **ATS-14F-14-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
The part number itself contains encoded information about its dimensions, material, and thermal properties.
| Specification | Details |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Dimensions (L x W x H)** | 50mm x 50mm x 20mm |
| **Fin Type** | Square / Straight |
| **Fin Pattern** | COARSE-PITCH |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Thermal Resistance** | ~9.97°C/W (Unducted Flow @ 100 LFM) |
| **Surface Finish** | Blue Anodized |
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### 2. Breakdown of the Part Number
The alphanumeric string follows a specific naming convention:
* **ATS-14**: Refers to the physical dimensions and the specific model series.
* **F**: Indicates the fin pitch (in this case, "Fine" or "Coarse" depending on the specific series catalog, but usually denotes specific airflow compatibility).
* **14**: Refers to the specific mechanical configuration/variant.
* **C2**: Denotes the **Thermal Interface Material (TIM)** provided. C2 typically indicates that the heatsink comes with **T766** phase-change material or a high-performance grease pre-applied.
* **R0**: Refers to the revision and the color/finish (Blue Anodized).
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### 3. Key Electronic/Mechanical Features
#### A. Push-Pin Attachment
This part uses a spring-loaded push-pin mechanism. This is critical for electronics because:
* It ensures **consistent pressure** across the component, improving thermal transfer.
* It allows for quick installation on pre-drilled PCBs (Printed Circuit Boards).
#### B. Thermal Performance
The "Square Fin" design is optimized for environments where airflow might be multidirectional. While its base thermal resistance is ~9.97°C/W at low airflow, it drops significantly (to roughly **1.56°C/W**) in high-velocity ducted environments.
#### C. Material and Finish
The **Blue Anodized** finish is not just for aesthetics; it provides:
* Increased surface emissivity for better radiation cooling.
* Corrosion resistance for long-term reliability in industrial environments.
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### 4. Typical Applications
* **Telecommunications:** Cooling of high-speed networking chips.
* **Power Supplies:** Heat dissipation for MOSFETs or IGPTs.
* **Embedded Systems:** Cooling for ARM or FPGA processors in industrial enclosures.
- ⤷
What are the PCB hole requirements for the ATS push-pin mounting system?
- ⤷ How does the C2 thermal interface material compare to standard thermal paste?
- ⤷ Are there low-profile alternatives in the ATS-14 series for slim enclosures?