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  • ATS-14F-14-C2-R0

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    The **ATS-14F-14-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number itself contains encoded information about its dimensions, material, and thermal properties. | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Dimensions (L x W x H)** | 50mm x 50mm x 20mm | | **Fin Type** | Square / Straight | | **Fin Pattern** | COARSE-PITCH | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | ~9.97°C/W (Unducted Flow @ 100 LFM) | | **Surface Finish** | Blue Anodized | --- ### 2. Breakdown of the Part Number The alphanumeric string follows a specific naming convention: * **ATS-14**: Refers to the physical dimensions and the specific model series. * **F**: Indicates the fin pitch (in this case, "Fine" or "Coarse" depending on the specific series catalog, but usually denotes specific airflow compatibility). * **14**: Refers to the specific mechanical configuration/variant. * **C2**: Denotes the **Thermal Interface Material (TIM)** provided. C2 typically indicates that the heatsink comes with **T766** phase-change material or a high-performance grease pre-applied. * **R0**: Refers to the revision and the color/finish (Blue Anodized). --- ### 3. Key Electronic/Mechanical Features #### A. Push-Pin Attachment This part uses a spring-loaded push-pin mechanism. This is critical for electronics because: * It ensures **consistent pressure** across the component, improving thermal transfer. * It allows for quick installation on pre-drilled PCBs (Printed Circuit Boards). #### B. Thermal Performance The "Square Fin" design is optimized for environments where airflow might be multidirectional. While its base thermal resistance is ~9.97°C/W at low airflow, it drops significantly (to roughly **1.56°C/W**) in high-velocity ducted environments. #### C. Material and Finish The **Blue Anodized** finish is not just for aesthetics; it provides: * Increased surface emissivity for better radiation cooling. * Corrosion resistance for long-term reliability in industrial environments. --- ### 4. Typical Applications * **Telecommunications:** Cooling of high-speed networking chips. * **Power Supplies:** Heat dissipation for MOSFETs or IGPTs. * **Embedded Systems:** Cooling for ARM or FPGA processors in industrial enclosures.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the ATS push-pin mounting system?
    • ⤷ How does the C2 thermal interface material compare to standard thermal paste?
    • ⤷ Are there low-profile alternatives in the ATS-14 series for slim enclosures?