The **ATS-14F-147-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Thermal Resistance (Flowing Air)** | 13.65°C/W @ 100 LFM | | **Thermal Resistance (Static Air)** | 26.00°C/W (approximate) | --- ### 2. Key Component Features #### A. Fin Design (maxiFLOW™) This part utilizes a **flared fin** geometry. Unlike standard straight-fin heat sinks, the fins spread outward. This design increases the surface area and maximizes air turbulence, which significantly improves cooling efficiency in constrained spaces. #### B. pushPIN™ Attachment The part uses a specialized "pushPIN" mounting system. This includes: * **Brass or Plastic Pins:** To secure the sink to the PCB. * **Compression Springs:** To provide consistent pressure (Force) across the thermal interface material (TIM). * **Pre-drilled Holes:** Designed for specific pitch patterns on a circuit board. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with **T412** thermal tape or a pre-applied phase-change material. This ensures that there are no microscopic air gaps between the electronic component (heat source) and the aluminum sink. --- ### 3. Part Number Breakdown To understand the electronic properties, we can decode the SKU: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **14F** | Fin style/Series | | **147** | Specific dimensions/model variant | | **C3** | Performance/Finish code (Blue Anodized) | | **R0** | Packaging or Thermal Interface Material version | --- ### 4. Application Use Cases * **Telecommunications:** Cooling for high-speed routers and switches. * **Embedded Systems:** Heat dissipation for small-form-factor industrial PCs. * **Power Supplies:** Cooling voltage regulators or power transistors.