The **ATS-14F-154-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the primary specifications: | Feature | Specification | | :--- | :--- | | **Product Type** | push-PIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (with Compression Springs) | | **Thermal Resistance** | ~7.51°C/W (at 100 LFM) | | **Fin Style** | Blue Anodized, Straight Fin | | **Dimensions** | 40mm x 40mm x 15mm | | **Weight** | ~45 Grams | --- ### 2. Breakdown of the Part Number The alphanumeric string defines the mechanical and thermal characteristics: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **14F:** Refers to the specific series of push-pin heat sinks. * **154:** Dimensions and fin density code. * **C2:** Material/Finish code (Blue Anodized Aluminum). * **R0:** Packaging or revision indicator. --- ### 3. Key Component Features #### A. Attachment Mechanism (push-PIN™) Unlike adhesive-based heat sinks, this model uses pre-drilled holes in the PCB and plastic pins with internal springs. This provides: * **Uniform Pressure:** Ensures optimal contact with the thermal interface material (TIM). * **Secure Fit:** Vibration resistance for industrial or automotive applications. * **Removability:** Allows for easier maintenance or component replacement compared to epoxy. #### B. Material and Thermal Conductivity The heat sink is made from **Aluminum 6063**. While copper has higher conductivity, aluminum is preferred in this form factor for being lightweight and providing better airflow efficiency through its fin geometry. #### C. The "C2" Blue Anodized Finish The blue coating is not just for aesthetics; anodizing increases the surface area at a microscopic level and protects the aluminum from oxidation, which can degrade thermal performance over time. --- ### 4. Thermal Performance Data Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Natural/Low)** | 7.51 | | **200 (Medium)** | 4.39 | | **400 (High)** | 3.07 |