The **ATS-14F-16-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height (H)** | 10.00 mm | | **Thermal Resistance** | 1.80°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Brass or Plastic) | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Key Components & Design Features #### A. Fin Design (High-Flow) The "14F" in the part number indicates a specific fin pattern designed to maximize surface area while maintaining low pressure drop. The flat-top design is optimized for high-velocity airflow environments. #### B. Attachment Mechanism: pushPIN™ Unlike adhesive-based heatsinks, this model uses a **push-pin** system. * **Benefits:** Provides consistent pressure for optimal thermal interface contact. * **Reliability:** Resistant to vibration and thermal cycling that might cause adhesives to fail. * **Installation:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### C. Material and Coating * **Aluminum Construction:** Offers a balance of high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides corrosion resistance and improves emissivity for radiative cooling. --- ### 3. Part Number Breakdown (Nomenclature) | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **14** | Series/Fin Style Identifier | | **F** | Fin Pitch (Fine/Dense) | | **16** | Specific Dimensions code | | **C2** | Thermal Performance Level / Coating | | **R0** | RoHS Compliant Version | --- ### 4. Applications * **Networking/Telecom:** Cooling for FPGAs and ASICs in routers and switches. * **Industrial PC:** Thermal management for high-load processors. * **Power Electronics:** Dissipating heat from power modules in compact enclosures.