The **ATS-14F-161-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating. --- ### 1. Technical Specifications Below are the primary technical attributes of this specific part: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 4.74°C/W (Unducted Flow @ 100 LFM) | | **Flow Direction** | Vertical / Omni-directional (Pin Fin) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical and thermal properties: 1. **ATS-14**: Indicates the series and basic design family. 2. **F**: Refers to the fin pitch or density configuration (Fine). 3. **161**: Represents the specific dimensions and internal geometry sequence. 4. **C2**: Specifies the material and thermal interface material (TIM). In this case, "C2" usually denotes a **T766** high-performance thermal phase-change material or a specific thermal pad. 5. **R0**: Indicates the revision number or packaging type. --- ### 3. Key Electronic Functions * **Passive Cooling:** This part does not consume electricity. It works by increasing the surface area of the heat-generating component (CPU, FPGA, or GPU), allowing ambient air to carry heat away more efficiently. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a mechanical push-pin system with a brass or plastic spring. This provides consistent pressure (preload) on the chip, ensuring optimal contact with the Thermal Interface Material (TIM). * **Omni-directional Airflow:** The "Pin Fin" design allows air to enter the heat sink from any direction, making it ideal for enclosures where airflow patterns are unpredictable. --- ### 4. Typical Applications * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Networking:** Cooling high-speed processors in routers and switches. * **Embedded Systems:** Industrial PCs where mechanical stability (via push-pins) is required due to vibration.