The **ATS-14F-162-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications This part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). It is characterized by its specific fin design and mounting mechanism. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.62 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Fin Style** | Straight Fin | | **Base Pattern** | Square | --- ## 2. Key Components & Design The "electronic" functionality of this part is passive, meaning it does not require electricity to run but is essential for the electrical stability of the system. ### A. The Heat Sink Body * **Material:** Made from high-grade aluminum for optimal thermal conductivity. * **Fin Design:** The straight-fin design allows for efficient airflow, typically paired with a cooling fan or high-velocity system air. ### B. The pushPIN™ Mounting System Instead of using messy thermal adhesives or complex screws, this part uses a specific spring-loaded mechanism: 1. **Push Pins:** Durable brass or plastic pins that snap into pre-drilled holes on the PCB. 2. **Compression Springs:** These ensure consistent pressure (10-stage) is applied to the heat source, maximizing thermal transfer. ### C. Thermal Interface Material (TIM) * The part usually comes with **pre-applied thermal interface material**. * This material fills microscopic air gaps between the component (like a CPU or FPGA) and the heat sink base to lower thermal resistance. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in identifying its specific characteristics: | Code Segment | Meaning | | :--- | :--- | | **ATS-14** | Series Identification | | **F** | Fine Pitch / Fin configuration | | **162** | Specific dimensional/thermal profile | | **C2** | Thermal Performance Class / Material Grade | | **R0** | RoHS Compliant / Revision code | --- ## 4. Typical Applications * **Networking Gear:** Switches and routers where high-heat FPGAs are used. * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Embedded Systems:** Industrial PCs where space is limited but heat dissipation is critical.