The **ATS-14F-166-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance (LFM 100)** | 12.30 °C/W | | **Dimensions (L x W)** | 25mm x 25mm | | **Height (H)** | 15mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **14**: Heat sink series (referring to the fin style and attachment type). * **F**: Fin pitch (indicates a specific density of fins). * **166**: Specific dimension profile/ID. * **C3**: Indicates the material/finish (Blue Anodized Aluminum). * **R0**: Version/Revision number (Standard ROHS compliant). --- ### 3. Key Electronic Functions While the heat sink itself does not have electrical circuitry, it is vital for the electronic stability of the system: 1. **Thermal Dissipation**: It increases the surface area of a hot electronic component, allowing airflow (convection) to carry away heat more efficiently. 2. **Thermal Resistance**: At a low airflow (100 Linear Feet per Minute), it offers a resistance of **12.30 °C/W**, meaning for every watt of power the chip consumes, its temperature will rise 12.30°C above the ambient air. 3. **Mechanical Attachment**: The **push-pin** mechanism uses a pre-drilled hole in the PCB and a compression spring to ensure constant, even pressure on the chip, which optimizes the thermal interface. 4. **EMI/RFI Consideration**: Being made of aluminum, it can occasionally influence the electromagnetic profile of the board, though its primary function remains purely thermal. --- ### 4. Application Example This part is commonly used in compact electronic housings where space is limited. ```yaml Application: Embedded Computing Component_Target: Voltage Regulator or Small Processor PCB_Mounting: 2-Hole push-pin layout Thermal_Interface: Pre-applied T766 Phase Change Material (usually included) ```