The **ATS-14F-167-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). --- ## 🛠️ Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 20.00mm | | **Fin Style** | Straight (Square) | | **Attachment Method** | Push-pin (Brass) | | **Thermal Resistance (Flow)** | 9.10 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 4.02 °C/W @ 700 LFM | | **Interface Material** | T766 (Thermal Tape/Grease) | --- ## 🧩 Component Breakdown ### 1. Thermal Performance The "C2" in the part number indicates the thermal performance category. This heat sink is designed for **forced air cooling** environments. As air velocity increases (measured in Linear Feet per Minute or LFM), the thermal resistance drops significantly, allowing for more efficient heat dissipation from the semiconductor. ### 2. Attachment Mechanism: pushPIN™ Instead of using messy adhesives or permanent solder, this part uses a **spring-loaded push-pin** system. - **Reliability:** Provides consistent pressure across the interface for optimal heat transfer. - **Maintenance:** Allows for easier removal and re-installation during PCB repairs. ### 3. Material and Coating - **Aluminum:** Chosen for its excellent weight-to-thermal conductivity ratio. - **Blue Anodized Finish:** This is not just for aesthetics; the anodization layer provides a degree of electrical insulation and increases surface emissivity, which slightly improves radiant heat transfer. --- ## 💻 Application Use Case This part is typically used to cool small-form-factor electronic components such as: - **BGA (Ball Grid Array) Chips** - **FPGAs** (Field Programmable Gate Arrays) - **CPUs/GPUs** in embedded industrial applications. ```yaml Part_Number: ATS-14F-167-C2-R0 Category: Thermal Management Type: Passive Heat Sink Attachment: Push-Pin RoHS: Compliant ```