The **ATS-14F-170-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the key physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with springs) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 15.00mm | | **Thermal Resistance (Unducted)** | 10.07 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 4.66 °C/W @ 100 LFM | | **Fin Type** | Fine-Pitch (Straight) | --- ## 2. Key Components & Design The "ATS-14F-170-C2-R0" part number follows a specific nomenclature that defines its electronic and mechanical application: ### A. Fin Profile (Fine-Pitch) This heat sink uses a **straight-fin design**. This provides a high surface-area-to-volume ratio, making it ideal for high-velocity airflow environments where heat needs to be moved away from the semiconductor quickly. ### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part uses a **spring-loaded push-pin** system. * **Mechanical Stability:** Ensures consistent pressure across the interface for optimal heat transfer. * **Easy Installation:** Pins click into pre-drilled holes on the PCB. * **Vibration Resistance:** Suitable for industrial or automotive electronics where movement is expected. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that it comes pre-applied with **ATS-PPS-02** thermal interface material. This ensures there are no air gaps between the chip and the aluminum base. --- ## 3. Usage Context This specific size (25mm x 25mm) is commonly used for: * **BGA (Ball Grid Array)** processors. * **FPGAs** (Field Programmable Gate Arrays). * **Network Switches** and high-speed routers. * **Power supplies** that require compact cooling solutions. ---