### ATS-14F-172-C2-R0: Part Analysis The **ATS-14F-172-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components like CPUs, GPUs, or power modules. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Series** | pushPIN™ HS | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing)** | 5.76 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.62 °C/W @ 700 LFM | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | --- ### Key Components & Design Features #### 1. Heat Sink Geometry The part features a **Cross-Cut** fin design. This layout allows for multi-directional airflow, making it efficient in systems where the direction of the cooling fan's exhaust might vary. #### 2. Push-Pin Attachment The `-R0` suffix indicates the mounting hardware. This model uses a **push-pin** mechanism combined with a compression spring: * **Easy Installation:** Requires pre-drilled holes in the PCB. * **Constant Pressure:** The spring ensures the heat sink maintains firm contact with the component to maximize heat transfer. #### 3. Thermal Interface Material (TIM) Usually, these parts come with a pre-applied high-performance thermal interface (like **ATS-54**), which fills microscopic air gaps between the heat sink and the chip. #### 4. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** Provides corrosion resistance and slightly improves thermal emissivity while providing a professional aesthetic. --- ### Application Usage This specific size (30mm x 30mm) is commonly used for: * **Northbridge/Southbridge** chipsets on motherboards. * **FPGA** and **ASIC** cooling in telecommunications equipment. * Small form factor industrial PCs.