The **ATS-14F-191-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and attachment method. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-14F-191-C2-R0 | | **Series** | pushPIN™ HS | | **Material** | Aluminum (Anodized Blue) | | **Fin Style** | Straight (High-Efficiency) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 30.00 mm | | **Attachment Type** | Push-Pin (Spring-loaded) | --- ### 2. Physical Design and Components This component consists of several integrated parts that work together to provide cooling: * **Heat Sink Body:** Extruded aluminum with high surface area fins. The 30mm height allows for significant convection cooling. * **Push-Pin Attachment:** The "R0" designation refers to the mounting hardware. It uses a spring-loaded push-pin mechanism that provides a consistent pressure (Force) against the chip for optimal thermal transfer. * **Thermal Interface Material (TIM):** Typically, these come with a pre-applied phase-change material or thermal pad on the base to fill microscopic air gaps between the heat sink and the chip. * **Blue Anodized Finish:** Not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves radiant heat transfer. --- ### 3. Thermal Performance Thermal resistance is the primary metric for this part. It measures how effectively the sink moves heat away from the component per Watt of power. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | ~2.90 | | **300 (1.5 m/s)** | ~1.30 | | **500 (2.5 m/s)** | ~1.00 | --- ### 4. Typical Applications Because of its 45mm x 45mm footprint, this part is commonly found in: * **Networking Hardware:** Switches, routers, and high-speed gateways. * **Industrial PCs:** Cooling embedded processors in fanless or forced-air environments. * **Power Electronics:** Cooling large MOSFET arrays or power modules.