The **ATS-14F-20-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Base Material** | Aluminum (AL6063) | | **Attachment Type** | Push-Pin (Brass/Plastic) | | **Thermal Resistance** | 7.14°C/W (at 100 LFM) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height (Fin)** | 25.00 mm | | **Fin Pitch** | Super Fine | | **Fin Type** | XCUT | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. XCUT Fin Design The "XCUT" geometry refers to the cross-cut pattern in the aluminum fins. This allows for **multi-directional airflow**, meaning the heat sink remains efficient even if the air inside the enclosure is turbulent or coming from various angles. #### B. pushPIN™ Attachment System Instead of using messy adhesives or fragile clips, this part uses a spring-loaded push-pin mechanism. * **Benefits:** Ensures constant pressure for maximum heat transfer and allows for easy installation/removal without damaging the PCB. * **Hardware:** Usually consists of a brass or plastic pin with a stainless steel spring. #### C. Thermal Interface Material (TIM) The part comes with **T766** thermal grease pre-applied to the base. This fills the microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal impedance. --- ### 3. Decoding the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **14**: Series identifier. 3. **F**: Attachment style (Push-pin type). 4. **20**: Specific size/design iteration. 5. **C2**: Material/Finish code (Blue Anodized). 6. **R0**: Revision or packaging indicator. --- ### 4. Typical Applications * **Telecommunications:** Cooling of high-speed networking chips. * **Industrial PC:** Thermal management for embedded controllers. * **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules.