## Technical Analysis: ATS-14F-202-C2-R0 The **ATS-14F-202-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed to provide a secure and efficient cooling solution for electronic components, specifically integrated circuits (ICs) and surface-mount devices. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-14F-202-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 6.00mm | | **Thermal Resistance** | 14.83 °C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | pushPIN™ (Plastic Pegs / Springs) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Component Features * **Low Profile Design:** With a height of only 6.00mm, this heat sink is ideal for space-constrained applications where vertical clearance is limited. * **XC (Square) Fin Pattern:** Features a cross-cut (XC) fin pattern which provides a large surface area for heat dissipation while allowing multidirectional airflow. * **Thermal Interface Material (TIM):** It comes pre-applied with **T766**, a high-performance thermal grease that ensures maximum heat transfer from the component to the heat sink. * **Secure Attachment:** The pushPIN™ mechanism uses a precise spring-loaded tensioning system that ensures uniform pressure across the component, preventing damage and improving thermal contact. --- ### 3. Thermal Performance Matrix Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 14.83 | | 200 | 1.0 | 6.91 | | 400 | 2.0 | 4.44 | | 600 | 3.0 | 3.51 | --- ### 4. Common Applications This part is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling routers, switches, and network processors. 2. **Embedded Systems:** Industrial PCs and small form factor (SFF) boards. 3. **Automotive:** ADAS sensors and infotainment control units. 4. **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.