The part number **ATS-14F-22-C3-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ### Technical Specifications The table below breaks down the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Fin Type** | XCUT (Cross-Cut) | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface (TIM)** | T412 (Applied) | --- ### Part Number Breakdown The nomenclature follows a specific logic used by ATS to identify the physical build of the heat sink: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **14F**: Series identification (usually related to fin geometry or material). 3. **22**: Specific size/profile indicator. 4. **C3**: Indicates the Thermal Interface Material (TIM) and the spring tension/type. 5. **R0**: RoHS compliance and revision status. --- ### Key Features and Usage * **XCUT Fin Geometry**: The fins are cut in both horizontal and vertical directions. This allows for multi-directional airflow, making it ideal for systems where air may be turbulent or coming from various angles. * **Push Pin Mounting**: This provides a secure, vibration-resistant attachment to the Printed Circuit Board (PCB). It requires pre-drilled holes in the PCB. * **Thermal Interface Material (T412)**: The part comes with a pre-applied phase-change material or high-performance thermal pad, ensuring optimal heat transfer from the chip to the aluminum surface right out of the box. * **Blue Anodization**: Beyond aesthetics, the anodized coating protects the aluminum from corrosion and slightly improves radiative heat transfer. --- ### Application Scenarios * **Networking Equipment**: Switches and routers with high-density processing. * **Industrial PCs**: For components requiring low-profile cooling (height is only 12.7mm). * **Embedded Systems**: Where mechanical stability (push pins) is preferred over adhesive tape.