The **ATS-14F-27-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The part number provides specific details regarding its dimensions, material, and thermal performance. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | XCUT (Cross-cut) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 70mm x 70mm x 12.7mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Component Breakdown ### A. Heat Sink Design (XCUT) The "XCUT" geometry refers to a cross-cut fin design. This provides several advantages: * **Omnidirectional Airflow:** Unlike straight-fin heat sinks, cross-cut fins allow air to enter and exit from multiple directions, making it ideal for systems where the airflow path is not strictly linear. * **Surface Area:** The cuts increase the overall surface area, improving the convective heat transfer coefficient. ### B. Attachment Mechanism (Push-Pin) This part uses a **Brass Push-Pin** with a high-tension spring. * **Reliability:** It ensures a consistent "clamping force" between the heat sink and the electronic component. * **Installation:** It requires pre-drilled holes in the PCB. The pins snap into place, providing a secure mechanical fit that is more durable than adhesive-based thermal tapes. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. * This is a high-performance thermal pad/grease designed to fill microscopic air gaps between the component die and the heat sink base, ensuring maximum heat conduction. --- ## 3. Thermal Performance Data Performance varies based on the velocity of the air flowing through the system (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 12.24 | | 300 (1.5 m/s) | 2.49 | | 500 (2.5 m/s) | 1.43 | --- ## 4. Common Applications * **Networking Equipment:** Switches and routers where airflow may be turbulent. * **Embedded Systems:** Industrial PCs requiring low-profile cooling (12.7mm height). * **Power Supplies:** Cooling high-wattage voltage regulators.