The **ATS-14F-40-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, known for its high-efficiency fin geometry. --- ### 1. Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-14F-40-C3-R0 | | **Base Dimensions** | 47.50mm x 48.30mm | | **Height** | 22.90mm | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.45°C/W (at 200 LFM) | --- ### 2. Key Features and Components #### A. Fin Geometry (maxiFLOW™) This heatsink uses a unique **tapered fin design**. Unlike standard straight-fin heatsinks, these fins are flared to maximize surface area and improve airflow convection. This design significantly reduces the "pressure drop" across the component, allowing for better cooling in restricted spaces. #### B. pushPIN™ Attachment The part utilizes the **pushPIN™** mounting system, which includes: * **Compression Springs:** Provide a precise amount of force (load) on the processor/chip to ensure optimal thermal contact. * **Brass/Plastic Pins:** Secure the heatsink directly to the PCB through pre-drilled holes. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates that the heatsink comes pre-applied with **T766 phase-change material**. This eliminates the need for manual thermal paste application and ensures a consistent, high-conductivity bond between the chip and the heatsink base. --- ### 3. Thermal Performance Profile The effectiveness of the ATS-14F-40-C3-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | |:---|:---| | 200 (1.0 m/s) | 1.45 | | 300 (1.5 m/s) | 1.02 | | 400 (2.0 m/s) | 0.85 | | 500 (2.5 m/s) | 0.75 | --- ### 4. Common Applications * **Networking Equipment:** High-speed routers and switches. * **Embedded Computing:** Industrial motherboards and single-board computers (SBCs). * **Power Electronics:** Cooling MOSFETs or power modules that generate significant heat in a small footprint. ---