The **ATS-14F-41-C3-R0** is a specific high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is a heat sink designed for cooling integrated circuits (ICs) and other electronic surface-mount components. --- ## 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 22.86mm | | **Attachment Method** | Push-pin (Brass) | | **Thermal Resistance** | 10.07°C/W (Unducted @ 100 LFM) | | **Fin Style** | Square Pin (High flow) | --- ## 2. Key Components & Design Features ### A. Material and Coating * **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** This is not just aesthetic; the anodization increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. ### B. Push-pin Attachment System The "ATS-14F" designation indicates a specific attachment style. * **Spring-loaded Pins:** It uses brass push-pins with a stainless steel spring. This ensures constant pressure on the processor/chip to maintain optimal contact with the Thermal Interface Material (TIM). * **Secure Mounting:** These pins lock into pre-drilled holes on the PCB (Printed Circuit Board). ### C. Fin Geometry * **Pin Fin Design:** Unlike straight-fin heat sinks that require linear airflow, pin-fin heat sinks are "omni-directional." They can capture air from any direction, making them ideal for systems with turbulent or unpredictable airflow. --- ## 3. Thermal Performance Profile Thermal resistance determines how efficiently heat is moved away from the component. Effectiveness increases as airflow (LFM - Linear Feet per Minute) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 10.07 | | 300 | 1.5 | 3.20 | | 500 | 2.5 | 2.11 | | 700 | 3.5 | 1.63 | --- ## 4. Typical Applications This specific heat sink is commonly used in: * **Networking Hardware:** Routers, switches, and gateways. * **Embedded Computing:** High-power ARM or FPGA modules. * **Power Supplies:** Cooling voltage regulators or MOSFET arrays. * **Industrial Controls:** Applications where vibration resistance (provided by the push-pins) is necessary.