The **ATS-14F-44-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series, designed to cool integrated circuits such as CPUs, GPUs, or other high-heat surface-mount components. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the device: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 15.00mm | | **Fin Style** | Fine Pitch (Rectangular) | | **Thermal Resistance (Unducted)** | 20.35 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.73 °C/W @ 100 LFM | --- ### 2. Part Number Breakdown The nomenclature for this part can be decoded as follows: - **ATS**: Advanced Thermal Solutions (Manufacturer). - **14**: Series Number (pushPIN™ Heat Sink). - **F**: Fin Pitch Type (Fine). - **44**: Specific geometry/model number. - **C2**: Thermal Interface Material (T766 Phase Change Material included). - **R0**: Revision or standard packaging code. --- ### 3. Key Electronic Components & Features #### A. Thermal Interface Material (TIM) The **C2** suffix indicates that the heat sink comes pre-applied with **T766** phase-change material. This ensures maximum heat transfer from the electronic chip to the aluminum sink by filling microscopic air gaps on the component's surface. #### B. Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system. - **Spring Loading:** Ensures constant pressure on the electronic component, which prevents the heat sink from shifting during thermal expansion or vibration. - **Serviceability:** Allows for easy removal and re-installation compared to permanent thermal epoxy. #### C. Fin Design The rectangular "Fine Pitch" design is optimized for environments with high-velocity airflow (fans/blowers). The increased surface area allows for efficient dissipation of heat away from sensitive silicon junctions. --- ### 4. Typical Applications This component is commonly used on: - **ASICs/FPGAs** in telecommunications equipment. - **Voltage Regulator Modules (VRMs)** on motherboards. - **High-speed Networking Switches.** - **Embedded Computing** systems where space is limited.