ATS-14F-49-C2-R0
AI

The **ATS-14F-49-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling processors and other heat-generating electronic components.
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### ## Technical Specifications
The table below summarizes the core physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-14F-49-C2-R0 |
| **Product Type** | Heat Sink |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Thermal Resistance** | 5.48° C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 25mm x 25mm x 20mm |
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### ### Key Features
1. **High-Efficiency Fin Design**:
The "F" in the part number indicates a **fine pitch** or high-density fin structure. This increases the surface area available for heat dissipation within a small footprint.
2. **Push-Pin Attachment**:
Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. This provides a constant pressure (compression) on the chip, ensuring a better interface with thermal paste and allowing for secure mounting in high-vibration environments.
3. **Cross-Cut Architecture**:
The fins are typically cross-cut, which allows for multi-directional airflow. This is critical in server or compact enclosures where airflow might not be strictly linear.
4. **Material and Coating**:
Made from high-grade aluminum for lightweight thermal conductivity. The **Blue Anodized** finish provides a layer of corrosion resistance and electrical insulation for the surface of the sink.
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### ### Typical Applications
* **Integrated Circuits (ICs)**: Cooling BGA (Ball Grid Array) components.
* **Networking Hardware**: Routers, switches, and modems.
* **Embedded Systems**: Small form-factor industrial PCs.
* **Power Supplies**: Dissipating heat from voltage regulators.
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### ### Thermal Performance Data
Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural/Low Flow) | 5.48 |
| 200 | 3.22 |
| 400 | 2.51 |
| 600 | 2.14 |
- ⤷
What is the hole-to-hole spacing requirement for mounting this heat sink?
- ⤷ Does this model come with a pre-applied thermal interface material (TIM)?
- ⤷ What are the advantages of push-pin mounting over thermal tape?