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  • ATS-14F-49-C2-R0

  • AI
    The **ATS-14F-49-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling processors and other heat-generating electronic components. --- ### ## Technical Specifications The table below summarizes the core physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-14F-49-C2-R0 | | **Product Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 5.48° C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | --- ### ### Key Features 1. **High-Efficiency Fin Design**: The "F" in the part number indicates a **fine pitch** or high-density fin structure. This increases the surface area available for heat dissipation within a small footprint. 2. **Push-Pin Attachment**: Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. This provides a constant pressure (compression) on the chip, ensuring a better interface with thermal paste and allowing for secure mounting in high-vibration environments. 3. **Cross-Cut Architecture**: The fins are typically cross-cut, which allows for multi-directional airflow. This is critical in server or compact enclosures where airflow might not be strictly linear. 4. **Material and Coating**: Made from high-grade aluminum for lightweight thermal conductivity. The **Blue Anodized** finish provides a layer of corrosion resistance and electrical insulation for the surface of the sink. --- ### ### Typical Applications * **Integrated Circuits (ICs)**: Cooling BGA (Ball Grid Array) components. * **Networking Hardware**: Routers, switches, and modems. * **Embedded Systems**: Small form-factor industrial PCs. * **Power Supplies**: Dissipating heat from voltage regulators. --- ### ### Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low Flow) | 5.48 | | 200 | 3.22 | | 400 | 2.51 | | 600 | 2.14 |
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing requirement for mounting this heat sink?
    • ⤷ Does this model come with a pre-applied thermal interface material (TIM)?
    • ⤷ What are the advantages of push-pin mounting over thermal tape?