ATS-14F-54-C2-R0
AI

### ATS-14F-54-C2-R0: Technical Overview
The **ATS-14F-54-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Plastic) |
| **Dimensions (L x W)** | 35mm x 35mm |
| **Height** | 25mm |
| **Thermal Resistance** | 6.70°C/W (at 200 LFM) |
| **Pressure Drop** | 0.28 (at 200 LFM) |
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### 2. Component Design Details
#### A. Fin Pattern (Cross-Cut)
The ATS-14F series features a **cross-cut** fin pattern. This design allows for:
* **Multidirectional Airflow:** Efficient cooling regardless of which direction the fan is blowing.
* **Reduced Pressure Drop:** Allows air to flow through the sink more easily compared to straight-fin designs.
#### B. Attachment Mechanism
It uses a **Push Pin and Spring** system.
* **Reliability:** Ensures consistent pressure (clamping force) on the electronic chip, which optimizes the interface between the chip and the heat sink.
* **Ease of Install:** Requires pre-drilled holes in the PCB (Printed Circuit Board).
#### C. Thermal Interface Material (TIM)
The "R0" suffix typically indicates that the part comes with **T766** phase-change material or a similar high-performance thermal pad pre-applied to the base. This eliminates the need for manual thermal paste application.
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### 3. Thermal Performance Metrics
Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 (1.0 m/s)** | 6.70 |
| **400 (2.0 m/s)** | 3.20 |
| **600 (3.0 m/s)** | 2.50 |
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### 4. Applications
* **Integrated Circuits (ICs):** BGA (Ball Grid Array) components.
* **Power Electronics:** Voltage regulators and power transistors.
* **Networking Hardware:** Switches and routers where vertical space is available but PCB footprint is limited.
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- ⤷
What are the PCB hole requirements for the push pin attachment?
- ⤷ How does the 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used with a different thermal interface material?