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  • ATS-14F-54-C2-R0

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    ### ATS-14F-54-C2-R0: Technical Overview The **ATS-14F-54-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 25mm | | **Thermal Resistance** | 6.70°C/W (at 200 LFM) | | **Pressure Drop** | 0.28 (at 200 LFM) | --- ### 2. Component Design Details #### A. Fin Pattern (Cross-Cut) The ATS-14F series features a **cross-cut** fin pattern. This design allows for: * **Multidirectional Airflow:** Efficient cooling regardless of which direction the fan is blowing. * **Reduced Pressure Drop:** Allows air to flow through the sink more easily compared to straight-fin designs. #### B. Attachment Mechanism It uses a **Push Pin and Spring** system. * **Reliability:** Ensures consistent pressure (clamping force) on the electronic chip, which optimizes the interface between the chip and the heat sink. * **Ease of Install:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with **T766** phase-change material or a similar high-performance thermal pad pre-applied to the base. This eliminates the need for manual thermal paste application. --- ### 3. Thermal Performance Metrics Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 6.70 | | **400 (2.0 m/s)** | 3.20 | | **600 (3.0 m/s)** | 2.50 | --- ### 4. Applications * **Integrated Circuits (ICs):** BGA (Ball Grid Array) components. * **Power Electronics:** Voltage regulators and power transistors. * **Networking Hardware:** Switches and routers where vertical space is available but PCB footprint is limited. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push pin attachment?
    • ⤷ How does the 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used with a different thermal interface material?