ATS-14F-59-C2-R0
AI

The **ATS-14F-59-C2-R0** is a specific model of a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to their "blue ice" or high-performance push-pin series designed for cooling electronic components like CPUs, GPUs, or FPGAs.
---
### ## Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-14F-59-C2-R0 |
| **Material** | Aluminum (Blue Anodized) |
| **Thermal Resistance** | 7.94°C/W (at 200 LFM) |
| **Dimensions** | 40mm x 40mm x 25mm |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **TIM (Interface Material)** | T766 (Pre-applied) |
---
### ### Breakdown of Key Electronic Parts/Features
#### 1. Thermal Interface Material (TIM)
The **C2** suffix indicates that this unit comes pre-applied with **T766 thermal phase change material**.
- **Function:** It fills the microscopic air gaps between the heat source (electronic chip) and the heat sink base to ensure maximum heat transfer.
- **Benefit:** Eliminates the need for manual thermal paste application during assembly.
#### 2. Push-Pin Mounting Mechanism
The **R0** designation refers to the attachment style.
- **Components:** It uses plastic push-pins and brass or steel springs.
- **Benefit:** This provides a standardized amount of pressure (load) on the electronic component, which prevents damage to the die while ensuring stable thermal contact.
#### 3. Fin Design (Cross-Cut)
The heat sink features a **straight fin** or **cross-cut** design.
- **Material:** Extruded aluminum, which is lightweight and has high thermal conductivity.
- **Function:** The fins increase the surface area available for convective cooling by the surrounding air.
#### 4. Blue Anodized Finish
The blue coating is not just for aesthetics; it is an **anodized finish**.
- **Protection:** It protects the aluminum from corrosion and electrical oxidation.
- **Radiation:** Anodized surfaces slightly improve the emissivity of the heat sink, aiding in heat radiation.
---
### ### Typical Application
This part is commonly used in:
* **Networking Equipment:** Routers and switches.
* **Industrial PCs:** Cooling embedded processors.
* **Power Supplies:** Managing heat in high-wattage converters.
- ⤷
What are the alternative mounting options for this heat sink series?
- ⤷ How does the T766 thermal interface material perform compared to standard thermal grease?
- ⤷ Can this heat sink be used for passive cooling without a fan?