The **ATS-14F-66-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "blue-Anodized" push-pin series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table highlights the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 35mm | | **Thermal Resistance** | 0.81°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | | **Compliance** | RoHS Compliant | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the component's features: - **ATS**: Manufacturer (Advanced Thermal Solutions). - **14**: Series identifier (referring to the attachment type and fin style). - **F**: Indicates the thermal interface material or specific mounting hardware configuration. - **66**: Represents the specific footprint and geometry. - **C2**: Refers to the thermal performance grade and material (Aluminum 6063). - **R0**: Revision code, typically indicating the standard version with standard packaging. --- ### 3. Key Electronic Functions The ATS-14F-66-C2-R0 serves several critical roles in an electronic assembly: * **Thermal Dissipation:** Its primary job is to increase the surface area of a heat-generating component (like a CPU, FPGA, or Power MOSFET) to allow for more efficient cooling via convection. * **Active vs. Passive Cooling:** While it can operate in a passive environment, it is optimized for **forced-air cooling** (using fans), as indicated by its low thermal resistance at specific Linear Feet per Minute (LFM) ratings. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this part uses a mechanical push-pin and spring mechanism. This provides constant pressure for better thermal contact and allows for easy removal or rework of the PCB. --- ### 4. Typical Applications * **Networking Equipment:** Used on high-speed switches and routers. * **Embedded Systems:** Industrial PCs where high-height fins (35mm) are permitted. * **Power Supplies:** Cooling voltage regulators and high-current modules.