### Technical Overview: ATS-14F-67-C2-R0 The **ATS-14F-67-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series and is specifically designed for cooling electronic components such as CPUs, GPUs, and high-power chipsets. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink Assembly | | **Attachment Type** | pushPIN™ (Plastic Pins & Springs) | | **Heat Sink Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 12.03 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Pitch** | Fine Pitch | --- ### 2. Component Design & Mechanical Features * **Heat Sink Material:** Constructed from high-quality aluminum to ensure lightweight durability and efficient thermal conductivity. * **Fin Profile:** Features a "Fine Pitch" design. This maximizes the surface area within a small footprint, allowing for better heat dissipation in systems with airflow. * **Attachment Mechanism:** Uses the **pushPIN™** system. This consists of a plastic pin and a high-performance compression spring that ensures consistent pressure between the heat sink and the component, optimizing thermal transfer. * **Thermal Interface Material (TIM):** Typically comes pre-applied with a high-performance thermal phase-change material or grease to bridge the gap between the component and the sink. --- ### 3. Thermal Performance Metrics The efficiency of this part is measured by its thermal resistance at various airflow speeds (Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 12.03 | | **200 (1.0 m/s)** | 4.77 | | **300 (1.5 m/s)** | 3.32 | | **400 (2.0 m/s)** | 2.71 | | **500 (2.5 m/s)** | 2.36 | --- ### 4. Application Use Cases 1. **Telecommunications:** Cooling of networking switches and routers. 2. **Computing:** Chipset cooling on motherboards or embedded systems. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators where vertical space is limited (10mm height).