The **ATS-14F-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 11.31°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | --- ## 2. Key Component Features ### A. Material and Design * **Aluminum Construction:** Offers a high thermal conductivity-to-weight ratio, ensuring efficient heat transfer while remaining lightweight. * **Fine Pitch Fins:** The "Straight Fin" design provides a large surface area for air to pass through, which is essential for cooling via natural or forced convection. * **Blue Anodized Finish:** This is not just aesthetic; the anodization protects the aluminum from corrosion and slightly improves radiant heat emissivity. ### B. pushPIN™ Attachment System This part uses a specific mounting mechanism consisting of: 1. **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes on the PCB. 2. **Compression Springs:** These provide consistent "Force-on-Component," ensuring the heat sink maintains firm contact with the chip for optimal heat transfer. ### C. Thermal Interface Material (TIM) * The part usually comes with **T766** pre-applied thermal phase-change material or a high-performance thermal pad on the base, eliminating the need for external thermal paste during assembly. --- ## 3. Physical Dimensions | Dimension | Value | | :--- | :--- | | **Length (A)** | 45.00 mm | | **Width (B)** | 45.00 mm | | **Height (C)** | 20.00 mm | | **Pitch (E)** | 38.00 mm (Distance between mounting holes) | --- ## 4. Performance Summary The efficiency of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM). As airflow increases, the thermal resistance drops, allowing the component to stay cooler under higher loads. * **Low Airflow (100 LFM):** ~11.31 °C/W * **High Airflow (700 LFM):** ~1.73 °C/W