The **ATS-14F-80-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and features. ### 1. General Specifications The part belongs to the **pushPIN™** series manufactured by **Advanced Thermal Solutions (ATS)**. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-14F-80-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.90°C/W (at 100 LFM) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout and ensuring no interference with surrounding components. | Dimension | Value (mm) | | :--- | :--- | | **Length (X)** | 30.00 mm | | **Width (Y)** | 30.00 mm | | **Height (Z)** | 15.00 mm | | **Pitch (Distance between holes)** | 35.00 mm | --- ### 3. Key Electronic/Thermal Features * **Fin Design:** It features a **square-fin** (or cross-cut) pattern. This allows for multi-directional airflow, making it efficient in systems where the direction of the cooling fan might vary. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. T766 is a high-performance thermal phase-change material that ensures minimal air gaps between the component and the heatsink. * **Push-Pin Mounting:** It uses a spring-loaded mechanism. This provides consistent pressure (clamping force) on the chip, which prevents the heatsink from shifting during shipping or vibration while ensuring optimal thermal contact. --- ### 4. Thermal Performance Data The effectiveness of the heatsink depends on the Airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 1.90 | | **300 (1.5 m/s)** | 1.15 | | **500 (2.5 m/s)** | 0.95 | --- ### 5. Application Usage This part is commonly used for: * **CPUs/GPUs:** Small form factor processors. * **ASICs/FPGAs:** High-heat generating logic gates in networking equipment. * **Power Supplies:** Cooling voltage regulators or transistors.