The **ATS-14F-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 1.62 °C/W (at 100 LFM) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height** | 25.00mm | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### ### Key Features & Components 1. **Fin Design (Cross-Cut):** The "F" in the part number often refers to the fin pattern. This heat sink uses a cross-cut or square pin design, which allows for multi-directional airflow. This is critical in systems where air direction is inconsistent. 2. **Push-Pin Attachment:** It utilizes a push-pin mechanism with a spring-loaded system. This ensures consistent pressure between the heat sink and the electronic component, optimizing thermal transfer. 3. **T766 Thermal Interface Material:** The base comes pre-applied with T766 TIM. This eliminates the need for manual thermal paste application and ensures a low-resistance path for heat to travel from the chip to the aluminum fins. 4. **Blue Anodized Finish:** Beyond aesthetics, the blue anodizing provides corrosion resistance and increases surface emissivity, slightly improving radiant cooling. --- ### ### Typical Applications * **Embedded Systems:** Cooling for small form-factor processors. * **Networking Gear:** Heat dissipation for ASICs in routers and switches. * **Power Electronics:** Managing heat for high-voltage regulators or MOSFETs. ---