The **ATS-14F-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 6.96°C/W (at 100 LFM) | | **Flow Direction** | Vertical / Omni-directional | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm | | **Weight** | ~40 grams | --- ### 2. Key Components & Design Features #### A. Fin Design (Cross-Cut) The ATS-14F-84-C2-R0 features a **straight fin or cross-cut design**. This allows for "omni-directional" airflow, meaning it can dissipate heat effectively regardless of which direction the cooling fan is blowing across the PCB. #### B. Push-Pin Attachment Instead of using messy thermal adhesives or heavy screws, this part uses the **pushPIN™ system**: * **Compression Spring:** Ensures constant, uniform pressure on the electronic chip. * **Ease of Install:** Can be snapped into pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the heat sink comes with a **pre-applied Thermal Interface Material**. This is a layer of conductive paste or pad on the bottom surface that fills microscopic air gaps between the heat sink and the component to improve heat transfer. --- ### 3. Electronic Application This part is typically used in the following scenarios: 1. **Telecommunications:** Cooling signal processors in base stations. 2. **Embedded Systems:** Protecting microcontrollers in industrial automation. 3. **Power Supplies:** Managing heat in DC-DC converters. ---