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  • ATS-14F-85-C2-R0

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    The **ATS-14F-85-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series of high-performance heat sinks. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W)** | 40mm x 40mm | | **Height (Fin Depth)** | 10mm | | **Thermal Resistance** | 23.98 °C/W (@ 1.0 m/s) | | **Flow Pattern** | Spread Fin (maxiFLOW™) | --- ## 2. Key Design Elements ### A. maxiFLOW™ Architecture The "85" in the part number refers to the specific fin geometry. The maxiFLOW™ design features a **graduated fin field** that reduces pressure drop and increases surface area. This allows for better airflow through the heat sink compared to standard square-cut fins. ### B. pushPIN™ Attachment System This part utilizes the ATS pushPIN™ system, which includes: * **Pre-assembled springs:** Ensures a precise, consistent pressure (TIM compression). * **Brass/Plastic Pins:** Secure the heat sink to the PCB via pre-drilled holes. * **Ease of Installation:** No tools are required for mounting, reducing mechanical stress on the CPU/chipset. ### C. Thermal Interface Material (TIM) The **"R0"** suffix typically indicates that the product comes with a pre-applied high-performance thermal interface material (phase-change or grease), ensuring low contact resistance between the electronic component and the aluminum base. --- ## 3. Application Use Cases This specific heat sink is designed for low-profile applications where vertical space is limited but high thermal dissipation is required. * **Networking:** Routers, switches, and small-form-factor gateways. * **Embedded Systems:** Industrial PCs and Single Board Computers (SBCs). * **Power Electronics:** Cooling for MOSFETs or power regulators. --- ## 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **14:** Series/Attachment Style. * **F:** Fin Pitch/Density. * **85:** Specific Fin Design/Geometry. * **C2:** Blue Anodized Finish. * **R0:** Revision/Packaging/TIM code.
    ✨ Follow-up Questions
    • ⤷ How does the thermal resistance change at higher airflow speeds (e.g.
    • ⤷ 2.0 m/s)?
    • ⤷ What are the exact hole-to-hole spacing dimensions for the pushPIN mounting?
    • ⤷ Are there taller versions of this heat sink for higher TDP components?