ATS-14F-85-C2-R0
AI

The **ATS-14F-85-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series of high-performance heat sinks.
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## 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W)** | 40mm x 40mm |
| **Height (Fin Depth)** | 10mm |
| **Thermal Resistance** | 23.98 °C/W (@ 1.0 m/s) |
| **Flow Pattern** | Spread Fin (maxiFLOW™) |
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## 2. Key Design Elements
### A. maxiFLOW™ Architecture
The "85" in the part number refers to the specific fin geometry. The maxiFLOW™ design features a **graduated fin field** that reduces pressure drop and increases surface area. This allows for better airflow through the heat sink compared to standard square-cut fins.
### B. pushPIN™ Attachment System
This part utilizes the ATS pushPIN™ system, which includes:
* **Pre-assembled springs:** Ensures a precise, consistent pressure (TIM compression).
* **Brass/Plastic Pins:** Secure the heat sink to the PCB via pre-drilled holes.
* **Ease of Installation:** No tools are required for mounting, reducing mechanical stress on the CPU/chipset.
### C. Thermal Interface Material (TIM)
The **"R0"** suffix typically indicates that the product comes with a pre-applied high-performance thermal interface material (phase-change or grease), ensuring low contact resistance between the electronic component and the aluminum base.
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## 3. Application Use Cases
This specific heat sink is designed for low-profile applications where vertical space is limited but high thermal dissipation is required.
* **Networking:** Routers, switches, and small-form-factor gateways.
* **Embedded Systems:** Industrial PCs and Single Board Computers (SBCs).
* **Power Electronics:** Cooling for MOSFETs or power regulators.
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## 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **14:** Series/Attachment Style.
* **F:** Fin Pitch/Density.
* **85:** Specific Fin Design/Geometry.
* **C2:** Blue Anodized Finish.
* **R0:** Revision/Packaging/TIM code.
- ⤷
How does the thermal resistance change at higher airflow speeds (e.g.
- ⤷ 2.0 m/s)?
- ⤷ What are the exact hole-to-hole spacing dimensions for the pushPIN mounting?
- ⤷ Are there taller versions of this heat sink for higher TDP components?