The **ATS-14F-90-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power chipsets. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | Description | |:---|:---|:---| | **Base Dimensions** | 35 x 35 mm | The footprint area on the PCB/Chip. | | **Height** | 25 mm | Vertical clearance required. | | **Fin Style** | Straight Fin | Optimized for high-velocity airflow. | | **Material** | Aluminum | High thermal conductivity with low weight. | | **Attachment** | Push-Pin | Secure mechanical fastening with springs. | | **Interface Material** | T766 | Pre-applied high-performance Thermal Interface Material (TIM). | | **Finish** | Blue Anodized | Increases surface emissivity and corrosion resistance. | --- ### 2. Key Electronic Components #### A. The Heat Sink Body The body is constructed from extruded aluminum. Its primary electronic function is to increase the surface area of the heat-generating component, allowing for faster heat transfer into the surrounding air via convection. #### B. Push-Pin Fasteners Unlike adhesive tapes (which can degrade over time), this part uses **brass or plastic push-pins** with integrated springs. * **Constant Pressure:** Ensures a reliable mechanical bond between the heat sink and the chip. * **Shock/Vibration Resistance:** Ideal for industrial or automotive electronics where movement is expected. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the specific TIM applied to the base. * **Role:** It fills microscopic air gaps between the chip surface and the heat sink base. * **Importance:** Air is a poor conductor; the TIM ensures a low thermal resistance path for electrons (heat) to travel. --- ### 3. Performance Data Thermal performance is measured in **Thermal Resistance (°C/W)**. Lower values indicate better cooling efficiency. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | |:---|:---| | 200 (Unducted) | 6.36 | | 400 (Unducted) | 3.33 | | 600 (Unducted) | 2.50 | --- ### 4. Typical Applications * **Telecommunications:** Network switches and routers. * **Computing:** High-speed data processing units. * **Power Electronics:** Embedded systems requiring passive or active cooling in tight enclosures.