ATS-14F-94-C2-R0
AI

The **ATS-14F-94-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "maxiFLOW" product line, designed to optimize airflow and heat dissipation for high-power electronic components.
### 1. Technical Specifications
The following table highlights the core physical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance (LFM)** | 4.49 °C/W @ 200 LFM |
| **Heat Sink Type** | maxiFLOW (Tapered Fin) |
| **Attachment Method** | pushPIN™ |
| **Dimensions** | 40mm x 40mm x 25mm |
| **Flow Orientation** | Vertical / Omni-directional |
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### 2. Key Component Features
#### A. Fin Geometry (maxiFLOW™)
The "maxiFLOW" design features a high-aspect-ratio fin structure. Unlike standard square fins, these are tapered to reduce pressure drop and increase surface area, making them ideal for systems with constrained airflow.
#### B. pushPIN™ Attachment
The "14F" in the part number indicates the specific attachment mechanism. This system uses:
* **Compression Springs:** Provides high interface pressure to ensure maximum thermal transfer.
* **Brass/Plastic Pins:** Securely locks the heat sink into pre-drilled holes in the PCB.
#### C. Thermal Interface Material (TIM)
The **C2** designation typically signifies that the heat sink comes pre-applied with a high-performance thermal interface material (like T766), ensuring there are no air gaps between the heat source (CPU/GPU/FPGA) and the aluminum base.
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### 3. Application Use Cases
This specific model is commonly found in the following electronic environments:
1. **Telecommunications:** Cooling of high-speed networking chips.
2. **Industrial PC (IPC):** Management of embedded processors.
3. **Power Supplies:** Heat dissipation for MOSFETs and power regulators.
4. **Automotive Electronics:** Thermal management for ADAS modules.
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### 4. Part Number Breakdown
`ATS - 14 F - 94 - C2 - R0`
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **14:** Series/Attachment type (pushPIN™).
* **F:** Fin pitch/style.
* **94:** Specific dimension/footprint code.
* **C2:** Thermal Interface Material (TIM) and Performance grade.
* **R0:** Revision/RoHS compliance status.
- ⤷
How do I calculate the correct hole spacing for the pushPIN™ attachment?
- ⤷ What is the difference between the C1 and C2 variants of this heat sink?
- ⤷ Can this heat sink be used with a custom clip instead of push pins?