The **ATS-14F-97-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. This part is designed for cooling integrated circuits (ICs) like processors, FPGAs, or ASICs in high-airflow environments. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-14F-97-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass, 2-Pin) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 20.30°C/W (Unducted @ 100 LFM) | | **Flow Direction** | Vertical / Omni-directional | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Thermal Interface Material (TIM)** | T766 (High performance) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS-14**: Indicates the series of push-pin heatsinks. * **F**: Likely refers to the specific fin density or material characteristic. * **97**: Represents the specific dimensions and footprint (45mm x 45mm). * **C2**: Denotes the material and finish (usually Blue Anodized Aluminum). * **R0**: Refers to the version or revision (Standard production). --- ### 3. Key Electronic Design Features #### A. Attachment Mechanism The use of **brass push-pins** with a compression spring ensures a consistent and reliable downward pressure on the electronic chip. This prevents air gaps between the chip and the heatsink, maximizing heat transfer. #### B. Thermal Interface Material (TIM) The "C2" suffix indicates the inclusion of **T766 thermal grease** pre-applied to the base. This material fills microscopic imperfections between the heatsink base and the component surface, significantly reducing contact resistance. #### C. Airflow Efficiency The low profile (10mm height) and straight-fin design are optimized for systems where vertical space is limited (1U or 2U rack servers) and where there is forced air cooling (fans). --- ### 4. Typical Applications * **Networking Gear:** Switches, routers, and high-speed modems. * **Industrial PCs:** Compact embedded systems where passive or semi-passive cooling is required. * **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs).