The **ATS-14F-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized Finish) | | **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 15.00 mm | | **Attachment Type** | Push-Pin (Spring Loaded) | | **Attachment Material** | Brass (Plastic and Aluminum also available) | --- ## 2. Key Components & Design Features ### A. Fin Geometry (Cross-Cut) The "98" in the part number indicates a specific fin pattern. This model utilizes a **Cross-Cut** fin design. * **Purpose:** Allows for multidirectional airflow. This is critical in systems where air direction might change or where space is constrained, as it captures air from multiple angles compared to straight-fin heat sinks. ### B. pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the R0 series uses a specialized push-pin mechanism: * **Compression Springs:** Provides precise pressure on the component (TIM - Thermal Interface Material) to ensure maximum heat transfer. * **Reliability:** Rated for high-vibration environments, ensuring the heat sink does not shift during transport or operation. ### C. Thermal Interface Material (TIM) * The "C2" designation typically refers to the **T766** high-performance thermal phase-change material or grease pre-applied to the base. This ensures there are no air gaps between the heat sink and the chip. --- ## 3. Thermal Performance Profile The efficiency of this part depends heavily on the airflow (Velocity) within the electronic enclosure: | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Res (°C/W)** | 15.31 | 5.81 | 3.19 | 2.20 | 1.72 | --- ## 4. Typical Applications * **Telecommunications:** Base stations and networking switches. * **Embedded Computing:** High-speed data processing modules. * **Power Electronics:** Voltage regulators and power supplies. * **Automotive:** Electronic Control Units (ECUs) requiring robust mechanical mounting.