The **ATS-14G-89-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### Technical Specifications This part belongs to the **maxiFLOW™** series, designed to provide maximum surface area for cooling high-power electronic components. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-14G-89-C2-R0 | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.94 °C/W (@ 1.0 m/s airflow) | | **Dimensions (L x W x H)** | 36.83 x 36.83 x 20.00 mm | --- ### Core Design Components #### 1. Heat Sink Geometry (maxiFLOW™) The "89" in the part number refers to the specific fin geometry. The maxiFLOW design uses a **tapered fin structure** which reduces pressure drop and increases the surface area exposed to airflow. This is critical for cooling BGA (Ball Grid Array) components where space is limited but heat density is high. #### 2. Attachment Mechanism: pushPIN™ Unlike adhesive tapes or simple clips, the `pushPIN™` system ensures: * **Constant Pressure:** A brass or plastic pin with a high-tension spring maintains consistent contact between the heat sink and the component. * **Easy Installation:** Pre-drilled holes in the PCB allow for quick assembly. * **Vibration Resistance:** The mechanical locking mechanism prevents the heat sink from shifting during transport or operation. #### 3. Thermal Interface Material (TIM) The "C2" designation typically indicates that the part comes pre-applied with a **High-Performance Thermal Interface Material**. This fills the microscopic air gaps between the chip and the aluminum base to improve heat transfer efficiency. --- ### Application Usage This part is typically found in: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators.