The **ATS-14H-89-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | maxiFLOW™ | | **Dimensions** | 36.83mm x 36.83mm (Footprint) | | **Height** | 22.86mm | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 3.94°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | --- ### 2. Key Features * **maxiFLOW™ Design:** This heat sink features a tapered fin structure that maximizes the surface area for cooling while reducing the pressure drop across the device. * **pushPIN™ Attachment:** It utilizes a specialized mounting system that consists of a plastic or brass pin and a spring. This ensures a precise, high-pressure contact with the component for better thermal transfer. * **High Performance Material:** The aluminum body provides high thermal conductivity, and the blue anodized finish increases emissivity and protects against corrosion. * **Pre-applied Thermal Interface Material (TIM):** This specific model typically comes with **T766** thermal tape or grease already applied to the base, simplifying the assembly process. --- ### 3. Application Use Cases The ATS-14H-89-C2-R0 is commonly used in environments where airflow is directed and space is limited: 1. **Telecommunications:** Used on high-speed network switches and routers. 2. **Industrial Controls:** Cooling for power modules and motor controllers. 3. **Embedded Systems:** Protecting microprocessors in harsh thermal environments. --- ### 4. Thermal Performance Data Thermal resistance depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 7.95 | | 200 | 3.94 | | 300 | 2.72 | | 400 | 2.13 | ---