ATS-15A-101-C2-R0
AI

The **ATS-15A-101-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. These parts are designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Dimensions (L x W x H)** | 45mm x 45mm x 20mm |
| **Thermal Resistance** | ~4.73°C/W (at 200 LFM) |
| **Fin Style** | Straight Fin |
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### 2. Key Electronic & Mechanical Components
The assembly consists of four critical sub-parts that work together to protect electronic circuits:
#### A. The Heat Sink Body (Aluminum)
The body is manufactured using high-quality aluminum for optimal thermal conductivity. The **Blue Anodized** coating is not just aesthetic; it provides increased surface emissivity and corrosion resistance, enhancing radiant heat transfer.
#### B. The Push-Pin Mechanism
Unlike adhesive-based heat sinks, the **-C2-R0** series uses brass push-pins.
- **Advantage:** Provides consistent pressure (clamping force) across the component.
- **Reliability:** Prevents the heat sink from shifting during high-vibration environments (shock/drop testing).
#### C. Compression Springs
The springs ensure that the heat sink maintains firm contact with the electronic chip's surface. This constant pressure is vital for minimizing the **Thermal Interface Resistance**.
#### D. Thermal Interface Material (TIM)
While the model number specifies the hardware, these parts typically come pre-applied with a high-performance **Phase Change Material** or thermal pad to fill microscopic air gaps between the chip and the aluminum base.
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### 3. Part Number Breakdown (Nomenclature)
Understanding the "Electronic DNA" of the part:
1. **ATS**: Manufacturer (Advanced Thermal Solutions).
2. **15A**: Part Series (High-performance aluminum).
3. **101**: Specific Fin Geometry and footprint (45mm x 45mm).
4. **C2**: Material/Finish code (Blue Anodized Aluminum).
5. **R0**: Revision/Packaging code.
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### 4. Application Use-Case
This part is commonly found in:
* **Networking Equipment:** Routers and Switches.
* **Embedded Systems:** Industrial PCs and Automation controllers.
* **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
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- ⤷What are the mounting hole diameter requirements for this heat sink?
- ⤷ How does the thermal resistance change at different airflow (LFM) rates?
- ⤷ Is this heat sink compatible with standard 45x45mm BGA components?