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  • ATS-15A-101-C2-R0

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    The **ATS-15A-101-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. These parts are designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Thermal Resistance** | ~4.73°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Key Electronic & Mechanical Components The assembly consists of four critical sub-parts that work together to protect electronic circuits: #### A. The Heat Sink Body (Aluminum) The body is manufactured using high-quality aluminum for optimal thermal conductivity. The **Blue Anodized** coating is not just aesthetic; it provides increased surface emissivity and corrosion resistance, enhancing radiant heat transfer. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **-C2-R0** series uses brass push-pins. - **Advantage:** Provides consistent pressure (clamping force) across the component. - **Reliability:** Prevents the heat sink from shifting during high-vibration environments (shock/drop testing). #### C. Compression Springs The springs ensure that the heat sink maintains firm contact with the electronic chip's surface. This constant pressure is vital for minimizing the **Thermal Interface Resistance**. #### D. Thermal Interface Material (TIM) While the model number specifies the hardware, these parts typically come pre-applied with a high-performance **Phase Change Material** or thermal pad to fill microscopic air gaps between the chip and the aluminum base. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the "Electronic DNA" of the part: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **15A**: Part Series (High-performance aluminum). 3. **101**: Specific Fin Geometry and footprint (45mm x 45mm). 4. **C2**: Material/Finish code (Blue Anodized Aluminum). 5. **R0**: Revision/Packaging code. --- ### 4. Application Use-Case This part is commonly found in: * **Networking Equipment:** Routers and Switches. * **Embedded Systems:** Industrial PCs and Automation controllers. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. ---
    ✨ Follow-up Questions
    • ⤷What are the mounting hole diameter requirements for this heat sink?
    • ⤷ How does the thermal resistance change at different airflow (LFM) rates?
    • ⤷ Is this heat sink compatible with standard 45x45mm BGA components?