ATS-15A-151-C2-R0
AI

The **ATS-15A-151-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like processors, ASICs, and chipsets.
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### 1. Technical Specifications
The following table highlights the core physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Type** | pushPIN™ |
| **Dimensions (L x W)** | 35.00 mm x 35.00 mm |
| **Height** | 20.00 mm |
| **Pitch** | Fine-Pitch |
| **Pattern** | Straight Fin |
| **Weight** | ~10 grams |
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### 2. Electronic Application & Functionality
While the heat sink itself is a mechanical component, it is critical for the stability of electronic systems. Its "electronic" role involves:
* **Thermal Management:** It increases the surface area of a semiconductor package, allowing heat to dissipate into the surrounding air more effectively.
* **Performance Stability:** By preventing "thermal throttling," it allows high-speed CPUs and GPUs to maintain their maximum clock speeds.
* **Component Longevity:** Reducing the operating temperature of electronic junctions significantly extends the Mean Time Between Failures (MTBF).
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### 3. Key Design Features
* **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism that ensures precise pressure is applied to the electronic chip. This optimizes thermal contact while preventing mechanical damage to the PCB.
* **Fine-Pitch Fin Design:** The "Straight Fin" geometry is optimized for high-velocity airflow environments (active cooling with fans).
* **Pre-Applied Thermal Interface Material (TIM):** This part usually comes with high-performance thermal grease or a pad pre-applied to the base, ensuring a low-resistance thermal path between the chip and the aluminum.
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### 4. Part Number Breakdown (Nomenclature)
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **15A** | Part Series / Attachment Type |
| **151** | Specific Geometric Configuration |
| **C2** | Thermal Performance Grade / Material |
| **R0** | RoHS Compliant / Revision Status |
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What are the compatible PCB hole patterns for the pushPIN attachment system?
- ⤷ How does the 'C2' thermal grade compare to 'C1' or 'C3' in this series?
- ⤷ Is this heat sink suitable for natural convection (fanless) cooling?