The **ATS-15B-01-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **Blue-Anodized "pushPIN™"** series, designed for cooling integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications The following table highlights the primary electrical and physical characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 21.96 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Mounting Hole Pattern** | 33.00mm x 33.00mm | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Key Components & Design Features #### A. Thermal Efficiency The heat sink features a **fine-pitch fin design** (cross-cut) optimized for maximum surface area. This allows for efficient heat dissipation from the semiconductor junction to the surrounding air, particularly in forced-air environments. #### B. pushPIN™ Attachment System This part uses a specialized mechanical attachment rather than thermal adhesive: * **Spring-loaded mechanism:** Provides consistent pressure (Pre-assembled with a compression spring). * **Reliability:** Ensures a secure interface between the heat sink and the component, reducing the risk of the part falling off during vibration or shipping. #### C. Material & Finish * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides corrosion resistance and increases thermal emissivity. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic assemblies: 1. **Telecommunications:** Cooling of networking switches and routers. 2. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. 3. **Embedded Computing:** Cooling microprocessors or FPGAs on compact PCBs. --- ### 4. Thermal Performance Data Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | 700 (3.5m/s) | | :--- | :--- | :--- | :--- | :--- | | **Thermal Res (°C/W)** | 21.96 | 5.33 | 3.23 | 2.45 |