The **ATS-15B-06-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue" push-pin heat sink series, designed primarily for cooling BGA (Ball Grid Array) components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Mounting Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 20.17 °C/W (at 200 LFM) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height (Fin)** | 25.00mm | | **Attachment Hole Pattern** | 38.00mm x 38.00mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Component Breakdown ### A. The Heat Sink Body The "06" in the part number refers to the specific fin pattern and height. This model utilizes a **straight-fin** design, which is optimized for unidirectional airflow. The blue anodized finish is not just aesthetic; it increases the surface emissivity, aiding in heat radiation and protecting the aluminum from corrosion. ### B. Push-Pin Attachment Mechanism This part uses a spring-loaded push-pin system. This provides several advantages over adhesive tapes: * **Constant Pressure:** Ensures the heat sink remains in firm contact with the chip, maximizing heat transfer. * **Mechanical Stability:** More reliable in environments with high vibration or shock. * **Reusability:** Can be removed and reattached during maintenance without damaging the component. ### C. Thermal Interface Material (TIM) The "R0" designation usually indicates the inclusion of a pre-applied **T766 phase-change material**. This eliminates the need for manual thermal paste application, ensuring a uniform layer that melts and fills microscopic gaps when the component reaches operating temperature. --- ## 3. Application Use Cases This specific heat sink size (45mm) is standard for medium-to-large integrated circuits. Common applications include: * **Network Switches:** Cooling ASICs and processors. * **Industrial PCs:** Cooling embedded CPU modules. * **Power Electronics:** Dissipating heat from high-wattage voltage regulators. ---